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ULTRASONIC 55 MicroDrill

Highly stable and efficient drilling for mass production in semiconductor industry

Max. X-axis travel
21.7 in.
Max. Y-axis travel
21.7 in.
Max. Z-axis travel
20.1 in.
Max. workpiece diameter
19.7 in.
Max. workpiece height
15.7 in.
Max. workpiece weight
1322.8 lbs.
Control & software alternatives
SIEMENS

Highlights

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Fully integrated ULTRASONIC micro drilling spindle with up to 35,000 rpm

  • Process-reliable production of micro holes from ø 0.1 mm (depending on the material and parameters)
  • High-precision drilling force control for process stability (< 1 N), drilling with constant force and permanent tool wear control
  • Automatic core ejector for drill cores
  • Ultra-low-flow internal coolant supply (up to 40 bar), flow monitoring with resolution < 1 ml - always suitable cooling
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Compact, stiff, stable

  • Massive, thermally stable monolithic machine bed weighing 2,400 kg
  • High static and dynamic rigidity as well as perfect damping properties
  • Perfect machining performance thanks to high rigidity
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Rigid table

  • Constant dynamics (constant moving mass of the X, Y and Z slides; rigid table & workpiece!)
  • Stable support for the work table
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SIEMENS SINUMERIK ONE

  • Combines CNC, HMI, PLC, closed-loop control and communication tasks within a single PPU
  • 15” multi-touch control panel
ULTRASONIC Machining of Advanced Materials for the Semiconductor Industry
Micro Drilling with ULTRASONIC 55 MicroDrill by DMG MORI
Exclusive DMG MORI Technology Cycles: ULTRASONIC microDRILL

Service & training

Downloads & Technical Data

Workpiece
Max. workpiece diameter
19.7 in.
Max. workpiece height
15.7 in.
Max. workpiece weight
1322.8 lbs.
Clearance
Max. X-axis travel
21.7 in.
Max. Y-axis travel
21.7 in.
Max. Z-axis travel
20.1 in.