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Themed image CELOS by DMG MORI

ULTRASONIC MicroDrill Series

> 10,000 holes process reliable in one workpiece

Highlights
  • Highly stable and efficient drilling for mass production in semiconductor industry
  • 35,000 rpm drilling spindle
  • For the smallest tool diameter from ø 0.1 mm
  • Drilling force control for process stability (< 1 N)
Technical data
Max. X-axis travel
21.7 in.
Max. Y-axis travel
21.7 in.
Max. Z-axis travel
20.1 in.
Max. workpiece diameter
19.7 in.
Max. workpiece height
15.7 in.
Max. workpiece weight
1322.8 lbs.
Control & software
  • SIEMENS SINUMERIK ONE
Max. X-axis travel
Max. Y-axis travel
Max. Z-axis travel
Max. workpiece diameter
Max. workpiece height
Max. workpiece weight
Themed image product teaser picture
ULTRASONIC 55 MicroDrill
21.7 in.
21.7 in.
20.1 in.
19.7 in.
15.7 in.
1322.8 lbs.
Details

ULTRASONIC Series

The ULTRASONIC-technology allows an economical grinding, milling and drilling of hard and brittle Advanced Materials with up to 50% reduced process forces.

ULTRASONIC MicroDrill

With the ULTRASONIC 55 MicroDrill, DMG MORI specifically serves the niche for the process-reliable production of micro-holes in the semiconductor industry. The specially developed micro-drilling spindle allows ultrasonic-assisted drilling from ø 0.1 mm* and is therefore the perfect choice for mass production in glass and ceramics.
*depending on material/parameter